Gelid Solutions GP-Extreme 12W-Thermal Pad 80x40x1.0mm. Excellent Heat Conduction, Ideal Gap Filler. Easy Installation
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🧊 GP-EXTREME – High-Performance Thermal Pad (80x40x1.0 mm) 🧊 Engineered for users who demand reliable and efficient thermal management, the GP-EXTREME thermal pad by GELID Solutions delivers outstanding heat transfer for CPUs, GPUs, RAM, and other critical components. With a remarkable thermal conductivity of 12W/mK, it ensures top-tier cooling even under heavy workloads and extreme performance scenarios. 🔥 Superior Thermal Conductivity Thanks to its high 12W/mK thermal conductivity rating, GP-EXTREME rapidly dissipates heat, keeping temperatures in check and enhancing system stability. It’s perfect for gaming rigs, professional workstations, servers, and even industrial applications. 🧩 Flexible Gap Filler With a soft, compressible 1.0 mm thickness, this pad effortlessly conforms to uneven surfaces, eliminating air gaps and ensuring maximum contact between heat source and heatsink. Precision-engineered to enhance cooling performance across a wide range of devices. 🛠️ Easy to Apply and Reusable No mess, no hassle — just cut to size, place, and press. GP-EXTREME requires no thermal paste or special tools, making it ideal for DIY builders, tech professionals, or anyone upgrading their cooling system. It’s also reusable, making future maintenance easy and cost-effective. 💻 Universal Compatibility From desktops and laptops to game consoles and embedded systems, GP-EXTREME fits perfectly into a wide array of applications. It’s a professional-grade solution for any thermal interface need, offering reliability, safety, and peak performance.
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Select a product to estimate shipping.Looking for a reliable way to keep your high-performance components cool? The Gelid Solutions GP-Extreme Thermal Pad is designed to efficiently transfer heat away from your CPU, GPU, and other critical hardware, ensuring stable and responsive performance.
Key Highlights
- Exceptional Heat Transfer: Boasts a thermal conductivity of 12W/mK for rapid heat dissipation.
- Flexible Gap Filler: The 1.0mm thickness conforms to uneven surfaces, eliminating air gaps.
- Universal Compatibility: Works with a wide range of cooler heatsinks and components.
- Easy Installation: Simple to apply and provides a secure bond between heat source and heatsink.
- Lightweight Design: Weighing only 1 gram, it adds minimal bulk to your build.
Useful Facts
- Brand: Gelid Solutions
- Dimensions: 8L x 4W x 0.1H Centimeters
- Material: Designed for use with Aluminium Cooler Heatsinks
- Quantity: Includes 1 Thermal Pad
- Origin: Manufactured in China
Good Fit For
- Gaming PCs
- Workstations
- Servers
- Industrial Cooling Applications
- DIY PC Builders
| Main Specification | |
|---|---|
| Ražotājs | GELID HONG KONG, Gelid Solutions |
| Vienība Izmēri L x W x H | 8L x 4W x 0.1H Centimeters |
| Zīmols | Gelid Solutions |
| Vienību skaits | 1 |
| Iekļautas komponentes | THERMAL PAD |
| Produkta izmēri | 8L x 4W x 0.1H Centimeters |
| Globālais tirdzniecības identifikācijas numurs | 04897025781207 |
| Montēšanas tips | PCB kalns |
| Vienības svars | 1 Grams |
| Technical Details | |
| Daļas numurs | TP-GP01-B |
| Izcelsmes valsts | Ķīna |
| Item details | |
| Parauga numurs | TP-GP01-B |
| Vienības tipa nosaukums | THERMAL PAD |
| Others | |
| Importētāja kontaktinformācija | Indija or BALAJI IMPORTS or [email protected] |
| Produkta veids | THERMAL PAD |
| Iepakojuma kontaktinformācija | Gelid Hong Kong |
| Ražotāja kontaktinformācija | GELID HONG KONG |
| Dzesēšanas siltumsink materiāls | Alumīnijs |
| Dzesētāja siltumsink savietojamība | Universal |